PVD Technology
PVD Technology
PVD TECHNIQUES include:
Sputtering: High-energy inert gas ions bombard and sputter metal ions from a target, depositing a thin film on the substrate under high vacuum. Applicable to both reactive and non-reactive processes, with options for substrate biasing.
Cathodic Arc: Utilizing an electric arc to vaporize material from a cathode target, forming thin films of non-reactive or reactive metals and ceramics on substrates. Substrates can be biased or unbiased.
Thermal Evaporation: Tungsten filaments are heated to melt and vaporize low-melting-point materials like aluminum, creating a metal vapor that condenses onto substrates.
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